It's only a four-lane increase, nevertheless, it should be sufficient enough for motherboard vendors to offer at least some connectivity improvements. For comparison, existing Zen 3 chips deliver 24 PCIe 4.0 lanes. While the rumors still have Zen 4 on the PCIe 4.0 interface, ExecutableFix believes that processors will offer 28 PCIe 4.0 lanes. However, Zen 4 doesn't seem to carry over support for DDR4, unlike Alder Lake. It seems logical since Intel is already embracing DDR5 with its upcoming 12th Generation Alder Lake processors, and AMD probably doesn't want to be left in the dust. The extra pins should help improve power delivery as well as increase I/O connectivity.Īs for memory support, Zen 4 will no doubt support DDR5 memory. There's mention of a special edition 170W SKU, although the leaker didn't provide any details. If ExecutableFix's information is accurate, the Zen 4 processors could debut with a 120W TDP. However, it would certainly explain the increased TDP (thermal design power) ratings with Zen 4 chips. An additional CCD would push the core count up to 24, but that is pure speculation for now. Zen 3 maxes out at two CCD with eight cores each, which is how the Ryzen 9 5950X got up to 16 cores.
It wouldn't surprise us one bit if AMD added another core complex die (CCD) to Zen 4 to offer more cores. Zen 4 will likely continue to leverage a chiplet design.
Although we didn't count the contacts, we can assume that each section holds 859 contacts. The layout is similar to AMD's Ryzen Threadripper and EPYC processors. Curiously, the contacts appear to be divided into two sections. The leaker previously claimed that Zen 4 will employ the LGA1718 package, so the chip should have 1,718 contacts. The markup of how the processor may look appears intriguing. On the flipside, it's not unusual for motherboards to arrive with bent pins or cases of users accidentally dropping a processor into the socket and bending the pins in the process.Īccording to ExecutableFix, Zen 4 (presumably Raphael) processors will be the first Ryzen mainstream chips to arrive without pins. Some might argue that having the pins in the socket means you no longer have to worry about bending the processor pins during installation. It's debatable on whether a LGA design is safer over a Pin Grid Array (PGA) design for the end user. Although AMD utilizes the LGA design for its HEDT (High End Desktop) and server platforms, the chipmaker has never employed the layout on a mainstream consumer platform. If true, AM5 would mark a turning point in AMD's history. The AM5 socket has been rumored to shift over to a Land Grid Array (LGA) design, meaning the pins are in the socket instead of on the processor.
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